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1：Introduction to DynTIM

2：Parametric Study of an IGBT Cold Plate Geometry in Thermal Simulation

3：Laser Headlamps: Latest Developments and Future Prospect

4：Selecting the right Thermal Interface Material (TIM) for electronics packags based on accurate thermal measurement data

5：Quality Control at the Electronic Package and System Levels

6：Using Measurement Data in Electronics Thermal Design - T3Ster CTM generation and detailed FloTHERM model calibration

7：Thermal testing standards: JEDEC Standards – What’s the latest news?

8：LED Thermal Characterization Made Easy

9：T3Ster Validation of Thermal Models of IC Packages and More

10：Understanding the thermal impedances in power LED applications

11：Testing Thermal Interface Material (TIM) Analysis

12：Long Term Reliability in Electronic Systems

13：System Level Thermal Testing 101
1：Parametric Study of an IGBT Cold Plate Geometry in Thermal Simulation
2：Laser Headlamps: Latest Developments and Future Prospect
3：Selecting the right Thermal Interface Material (TIM)