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Cadence培訓(xùn)高級(jí)班將首先讓您了解CB板上出現(xiàn)的信號(hào)反射、串?dāng)_、電源/地平面干擾、時(shí)序匹配以及電磁兼容性等一系列問題產(chǎn)生的機(jī)理，并掌握其解決方法；然后講解并上機(jī)練習(xí)Cadence的高速 PCB設(shè)計(jì)與仿真工具SPECCTRAQuest的使用。使您在硬件設(shè)計(jì)過程中，能夠達(dá)到“設(shè)計(jì)即正確”的目的。

1 高速PCB設(shè)計(jì)中的理論基礎(chǔ)

傳輸線理論、信號(hào)完整性（反射、串?dāng)_、過沖、地彈、振鈴等）、電磁兼容性和時(shí)序匹配等等。

2 SPECCTRAQuest設(shè)計(jì)流程

2.1 Pre-Placement

2.2 Board Setup Requirements for Extracting and Applying Topologies

2.3 Database Setup Advisor

—Cross-Section

—DC Nets

—DC Voltages

—Device Setup . ??—SI Models

—SI Audit

3 拓?fù)浣Y(jié)構(gòu)的抽取與仿真 Extracting and Simulating Topologies

3.1 Pre-Route Extraction Setup—Default Model Selection.

3.2 Pre-Route Extraction Setup—Unrouted Interconnect

3.3 Pre-Route Template Extraction

3.4 SQ Signal Explorer Expert

3.5 Analysis Preferences

3.6 SigWave

3.7 Delay Measurements

4 確定和施加約束 Determining and Adding ConstraintsSolution

4.1 Solution SpaceAnalysis: Step 1 to 6

4.2 Parametric Sweeps.

4.3 Constraints

4.4 Usage of Constraints Defined in Topology Template

5 模板應(yīng)用和基于約束的布局

Template Applications and Constraint-Driven Placement

5.1 Creating a Topology

5.2 Wiring the Topology

5.3 TLines and Trace Models

5.4 Coupled Traces

5.5 RLGC Matrix of Coupled Trace Models

5.6 Crosstalk Simulation in SQ Signal Explorer Expert

5.7 Simulating with Coupled-Trace Models

5.8 Sweep Simulation Results with Coupled-Trace Models

5.9 Extracting a Topology Using the Constraint Manager

5.10 Electrical Constraint Set

5.11 Applying Electrical CSet

5.12 Worksheet Analysis

5.13 Spacing and Physical Rule Sets

5.14 Electrical Rule Set

6 基于約束的布線 Constraint-Driven Routing

6.1 Manual Routing

6.2 Routing with the SPECCTRA Smart Route

6.3 Driving Constraints in Routing

7 布線后的DRC檢查和分析 Post-Route DRC and Analysis

7.1 Post-Route Analysis

7.2 SigNoise

7.3 Reflection Simulation

7.4 Reflection Waveform Analysis

7.5 Comprehensive Simulation

7.6 Crosstalk Simulation

7.7 Crosstalk Analysis

7.8 Simultaneous Switching Noise Simulation

7.9 SSN Waveform Analysis

7.10 System-Level Analysis

7.11 A Complete Design Link

7.12 Initialize Design Link

8 差分信號(hào)設(shè)計(jì) Differential Pair Design Exploration

8.1 Types of Differential Pairs in SPECCTRAQuest

8.2 Create Differential Pair Using SPECCTRAQuest

8.3 Create Differential Pair Using Constraint Manager

8.4 Assigning Differential Pair Signal Models

8.5 Preference to Extract Unrouted Differential Pair Topology

8.6 Extracting Unrouted Differential Pair Topology

8.7 Custom Stimulus to Analyze Differential Pair Topology

8.8 Differential Pair Topology Analysis

8.9 Coupled Trace Model and Differential Pair Topology

8.10 Layout Cross-section Editor

8.11 Differential Pair Constraints

8.12 Differential Pair Constraints in the Constraint Manager

8.13 Differential Pair Analysis in the Constraint Manager

8.14 Post Route Extraction

9.SI 仿真

9.1 時(shí)序仿真

9.2 差分仿真

9.3 反射仿真

9.4 Crosstalk串?dāng)_仿真

9.5 EMI

10 PI 電源完整性仿真

10.1 電源完整性工具

10.2 電容器和單節(jié)點(diǎn)仿真流程

11.多板仿真

11.1 DesinLik模型創(chuàng)建

11.2 多板仿真

12.后仿真

12.1 反射仿真

12.2 綜合仿真

12.3 SSN同步開關(guān)噪聲仿真

12.4 串?dāng)_仿真

13.EMI/EMC仿真

13.1 仿真要點(diǎn)

13.2 仿真流程

14. IR-DROP電源壓降仿真